Titanium anode mesh for PCB horizontal copper plating
1.Coating type: Titanium-based iridium-tantalum
2.Titanium anode mesh for PCB horizontal copper plating superiority comparison with conventional lead anodes for electroplating:
1) Low cell voltage and low energy consumption
2) Low electrode loss rate and stable size
3)Good corrosion resistance and insolubility of the electrode it does not pollute the bath liquid and makes the performance of the coating more relable.
4) Titanium anode adopts new materials and structure, which greatly reduces its weight and is convenient for daily operation.
5) Long service life, and the matrix can be reused, saving cost.
6) Oxygen evolution overpotential is about 0.5V lower than that of lead alloy insoluble anode.Reduce the cell voltage and reduce energy consumption.
3.Electrochemical performance and life test
| Name | Strengthen weightlessness mg | Polarizability mv | Oxygen evolution/chlorine potential v | Test Conditions |
| Titanium-based iridium tantalum | ≤10 | <40 | <1.45 | 1mol/L H2SO4 |
4.Introduction to PCB Copper Plating
Acidc elecrolytic copper plating is an important link in the metallization process of printed circuit board holes.With the rapid development of microelecronics technology. printed circuit board manufacturing is developing rapidly in the direction of multilayer, layered, functional and integrated Promoting printed circuit design to adopt a large number of small holes,narrowpitches,and thin wires for the concept and design of circuit pattems,which makes the manfacturing technology of printed circuit boards more difficult ,especially the aspect ratio of multi-layer board through holes exceeds 5:1 and the porduct The large number of deep blind holes used in the laminate makes the conventional vertical electroplating process unable to meet the technical requirements for high-quality and high-reliability interconnection holes, so horizontal electroplating technology is produced.
1.PCB horizontal reverse pulse copper plating.
Due to the design requirements of circuit boards tend to be thin wire diameter , high density,fine aperture (high aspect ratio, even micro-via , and fill blind holes, the traditional DC elcroplating becomes more and more Unable to meet the requirement ,especially the plating layer in the center of the aperture of the through-hole plating,usually the cooper layer at both ends of the aperture is too think but the center copper layer is inosufficient.The unevenness of the coating will affect the effect of current transmission and directly lead to poor product quality. In order to balance the thickness of copper on the surface ,especially in the holes and micro-hols,it is forced to reduce the current density, but this will extend the platng time to an unacceptable level. With the development of the reverse pulse electroplating process and chemical additives suitable for the elecroplatig process, shrortening the platng time has become a reality, and these problems can be overcome by the reverse pulse electroplating process.
Typical electrolysis process of Titanium anode mesh for PCB horizontal copper plating:
Electrolyte: CuSO4/5H2O: 100-300g/L,H2SO4: 50-150g/L
Forward current density: 500-1000A/m2 Reverse current density: 3 times the forward
Direction Plating process: Two-way pulse temperature: 20-70℃
Forward time: 19ms; Reverse time: 1ms
Life requirement: 50000kA
Anode type: special iridium titanium anode
2.PCB vertical continuous DC copper plating
In the PCB vetical continuous DC copper plating process, special organic additives are added to promote the fine-grained metal deposition layer and the uniform distribution of the board surface. These additives must be maintained at the optimal concentration in order to exert their best function and obtain the best product quality.
This requires the anode to not only meet the life expectancy, but also consume as little organic additives as possible to reduce the cost of medicament consumption Although the traditonal iridium-based titanium anode can reach the required sevice life ,it consumes a ot of brightener. we has improved the process and formula of traditional iridium-base titanium anodes. The dedicated PCB level copper-plated titanum anodes that reduce the consumption of organic additives can achieve the required service life.
Typical electrolysis process:
Electrolyte: Cu:60-120g/L,H2SO4: 50-100g/L, Cl-: 40-55ppm
Current density: 100-500A/m2 Temperature: 0-35°℃
Life expectancy: 1 year or more
advantages of special iridium titanium anode : good electroplating uniformity, long life, energy saving and power saving,high current densty
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